Production process requirements for carrier packaging materials

1、 Raw material process requirements
The quality of raw materials directly determines the forming accuracy, anti-static performance, and service life of the carrier tape. It is necessary to strictly implement the incoming inspection and pretreatment process to eliminate impurities, deformation, and performance non-compliance issues.
-Substrate selection: High purity PS, PC, PET roll sheets are commonly used, and the selection is based on the product's suitability for the scene. PS material is suitable for conventional small and medium-sized surface mount components, PC material is suitable for deep cavity, high-strength, and bending resistant scenarios, and PET material is suitable for high transparency and high toughness precision packaging scenarios. All substrates must be scratch free, bubble free, impurity free, uniform in thickness, and meet batch performance consistency standards.
-Substrate parameter standard: The thickness tolerance of the substrate is controlled within ± 0.02mm, the surface cleanliness meets the Class 10000 requirements of the dust-free workshop, and there is no dust or particle adhesion; Raw materials entering the factory must provide material testing reports and anti-static parameter reports. It is strictly prohibited to use recycled inferior mixed substrates.
-Auxiliary material requirements: Anti static coatings, coating inks, adhesives, and other auxiliary materials should be compatible with the substrate material, have strong adhesion, no precipitation, and do not corrode electronic components, comply with environmental RoHS standards, and eliminate the risk of contaminating components.
-Raw material pretreatment: Before the production of the substrate roll, it needs to undergo constant temperature dehumidification pretreatment and be placed in an environment with a constant temperature of 23 ± 2 ℃ and humidity of 50 ± 5% for 24 hours to eliminate internal stress in the material and avoid deformation and warping of the cavity after molding.
2、 Core production process flow and process requirements
The mainstream mass production adopts hot forming technology (accounting for more than 85% of the industry's mass production), which is suitable for cavity depths of 0.1mm~8mm and can achieve complex cavity structure forming. The complete process is: substrate unwinding → constant temperature heating softening → vacuum/positive pressure forming → cooling and shaping → edge cutting and punching → anti-static treatment → winding → inspection and storage. The process requirements for each link are as follows.
1. Rolling and leveling process
Adopting uniform servo unwinding equipment, the unwinding speed is stable without shaking or stretching, avoiding deformation of the substrate under stress; Equipped with a leveling mechanism to completely eliminate wrinkles and warping of the coil material, ensuring that the substrate enters the heating process smoothly, with a constant tension throughout the process and a tension deviation of ≤ 5%.
2. Constant temperature heating softening process
Adopting a partitioned closed-loop temperature control heating system, precise temperature control is achieved according to the substrate material to prevent molding defects caused by local overheating and uneven softening: PS substrate heating temperature is 120-140 ℃, PC substrate heating temperature is 150-170 ℃, and temperature fluctuations are strictly controlled within ± 3 ℃. After heating, the substrate should be completely softened without melting, coking, or yellowing, ensuring full filling and uniform wall thickness during subsequent molding.
3. cavity forming process
Adopting high-precision molds combined with vacuum/positive pressure forming mode, the mold accuracy tolerance is ≤ 0.01mm, and the mold surface is polished without burrs, scratches, or wear. Core requirements for molding: The cavity should be fully filled, without defects such as material shortage, collapse, stretching whitening, deformation, etc; The gap between the cavity and the product is controlled within 0-0.1mm, accurately matching the shape of the components to avoid product shaking and deformation caused by compression after loading. At the same time, independent control of mold temperature zones is adopted to ensure the uniformity of the overall wall thickness of the carrier tape, and the thickness deviation is controlled within ± 0.03mm.
4. Cooling and shaping process
Immediately enter the constant temperature cooling station after molding, with the cooling temperature controlled at 25 ± 3 ℃ and sufficient cooling time to ensure rapid shaping of the cavity structure, without rebound or warping. Rapid rapid cooling or insufficient cooling is strictly prohibited to prevent deformation and cavity size deviation during subsequent use of the carrier tape.
5. Edge cutting and punching process
Adopting precision cutting and punching integrated equipment, the cutting edge is smooth and flat, without burrs, edges, or cracks; The positioning hole punching position is precise, with a hole tolerance of ≤± 0.02mm, and the hole edge is free of deformation or blockage, ensuring accurate adaptation of subsequent tape, packaging, and surface mount machines. The overall width tolerance of the carrier tape is strictly benchmarked against the EIA-481 standard, ensuring stable dimensional consistency throughout the entire process.
6. Anti static coating treatment process
According to the anti-static level requirements of the product, a conductive anti-static coating is uniformly applied on the surface of the carrier substrate, which can be applied on one or both sides. After coating, it is dried and cured at a constant temperature to ensure firm adhesion, uniform thickness, no missed coating, and no accumulation of material. After curing, the surface resistance value stabilizes at 10 ^ 6~10 ^ 11 Ω, meeting the requirements of anti-static packaging for electronic components and preventing electrostatic breakdown of precision components.
7. Precise winding process
The tension during the winding process is constant, arranged neatly, without offset, wrinkles, or compression deformation; The end face of the roll material is flat, with consistent elasticity. The length and number of turns of each roll are precisely controllable, and the tail of the roll is firmly fixed to avoid loosening or scratching the surface of the carrier tape during transportation and storage.