1、 Differences in Performance and Scene Effects of Four Mainstream Materials
1. Paper carrier tape (kraft paper composite)
Key material characteristics
The depth of the cavity is ≤ 1mm, it is not resistant to moisture, high temperature, cannot be used as a deep groove, environmentally friendly and easily degradable, electrostatically stable, the lowest price, and can only be used for 8mm narrow strips.
Limitations on the Scene
Applicable: Thin chip resistors and capacitors (0201/0402), small diodes, large quantities of low-cost small household appliances, chargers, and universal components for remote controls;
Cannot be used in damp workshops, large components, deep cavity components, vehicle mounted/high-temperature processes.
2. PS polystyrene carrier tape (the most commonly used plastic carrier tape on the market)
Key material characteristics
Easy to form, moderate cost, temperature resistance of ≈ 85 ℃, brittle at low temperatures, large thermal shrinkage, excellent shallow cavity forming.
Impact on the scene
Applicable: SOT-23, SMD LED, small inductor, small SOP, ordinary consumer electronics (headphones, power banks, smart bracelets) room temperature SMT patch;
Prohibited: Reflow soldering preheating in high-temperature environments, automotive high-temperature components, deep cavity large parts (shielding covers, connectors).
3. APET/PET carrier tape (preferred for precision components)
Key material characteristics
Small size shrinkage, high stability, permanent anti-static, temperature resistance of around 105 ℃, high transparency, high cavity accuracy, thin precision groove.
Impact on the scene
Applicable: Crystal oscillators, sensors, camera chips, QFN, FPC small parts, smart wearables, medical electronics, precision components for mobile phones;
Advantages: Small dimensional tolerance of components, no jamming of high-speed braiding machines, preferred for precision ICs;
Shortcoming: The cost of thick and deep cavities is relatively high, and oversized hardware is not cost-effective.
4. PC polycarbonate carrier tape (deep cavity, high temperature resistant)
Key material characteristics
Temperature resistance of 125 ℃, extremely strong toughness, capable of producing 5-15mm deep cavities, bending resistance, high strength, and relatively high price.
Impact on the scene
Applicable: connectors, shielding covers, power inductors, vehicle terminals, relays, large volume hardware spring plates, automotive electronics, new energy industrial control components;
It is the only preferred material for large shaped components;
No need for: micro 0402 resistor capacitor (cost waste).
5. PI Polyimide (Special High Temperature Carrier Tape)
Temperature resistance of 200 ℃+, ultra-high price
It is only used in military, automotive power chips, and high-temperature devices, and is almost not used in civilian electronic products.
Shenzhen Honghuixiang Technology Co., Ltd
Phone: 13428710250/13684974998
Email: 292966451@qq.com
Website: www.hhxjm.com
Address: 3rd Floor, Building M, Dongbao Industrial Zone, Shasi Community, Shajing Street, Bao'an District, Shenzhen